7 MACHINES FOR POLISHING OR LAPPING WORK-PIECES; EDGE POLISHING MACHINES FOR SILICON WAFERS; CHEMICAL MECHANICAL POLISHING MACHINES FOR POLISHING SURFACES OF SILICON WAFERS; MAGNETIC DISK PROCESSING MACHINES, NAMELY, FULLY AUTOMATED ANNEALING MACHINES, FULLY AUTOMATED POLISHING MACHINES, TEXTURING MACHINES, BURNISHING MACHINES, ALL FOR MAGNETIC DISKS; SURFACE GRINDING MACHINES FOR WORK-PIECES; PLATE FLATNESS MEASURING MACHINES FOR POLISHING MACHINES; POLISHING PADS FOR POLISHING MACHINES