Trademark: 76330816
Word
CU.P BOND
Status
Dead
Status Code
602
Status Date
Tuesday, September 17, 2002
Serial Number
76330816
Mark Type
5000
Filing Date
Monday, October 29, 2001
Abandoned Date
Tuesday, July 16, 2002
Trademark Owner History
Advanpack Solutions Pte Ltd.
Classifications
9 Conductive interconnect on, and extending from, an integrated circuit or semiconductor wafer; flip chip interconnect; pillar bump or interconnect; integrated circuit interconnect
40 Manufacture for others, namely, forming conductive material on an integrated circuit or semiconductor wafer; semiconductor bumping services; electroplating conductive material on integrated circuits or semiconductor wafers; integrated circuit packaging services; pillar bumping services
CUP BOND
Trademark Events
Sep 17, 2002
Abandonment - Failure To Respond Or Late Response
Jan 15, 2002
Non-Final Action Mailed
Jan 3, 2002
Assigned To Examiner
THE KINGDOM SUITE+
SMARTWEV
Trademark Alertz updated from USPTO on 2030-01-24

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