Trademark: 76328762
Word
KS
Status Date
Tuesday, June 17, 2014
Registration Number
2788019
Registration Date
Tuesday, December 2, 2003
Filing Date
Wednesday, October 24, 2001
Published for Opposition
Tuesday, September 9, 2003
41 Customer training in the use of equipment for back-end assembly of semiconductors; [ on-line consulting and advisory services for said training ]
40 Providing on-line information regarding packaging trends in the field of back-end assembly of semiconductors; providing technical information in the back-end assembly of semiconductors; [ assembly services for others, namely, prototype building of mechanical components and printed circuit boards; and wafer bumping services for others, namely, semiconductor assembly services for placement of solder balls onto individual integrated electrical circuits ]
9 Computerized electrical wire bonding machine used in the assembly of semiconductors and wire bonding materials, namely, substrates with copper inlay, [ polymer materials, namely, wire encapsulants applied over wire bonds to lock individual wires in place prior to molding, ] and bonding wires; bonder software, namely, software used to run automated wire bonders attaching bonding wire from the integrated circuit chip to a substrate material; [ dicing equipment, namely, electrical dicing equipment for sawing integrated circuit wafers and other hard materials into usable single components; ] factory automation software, namely, software designed for automated semiconductor material flow and gathering and collecting semiconductor assembly equipment data; [ wafer test products, namely, semiconductor probe cards that test the electrical functionality of an integrated circuit chip; package test products, namely, electrical sockets and contactors for testing the electrical functionality of a completed integrated circuit package; and electrical circuit substrates ]
8 Hand-operated wire bonding equipment, namely semiconductor assembly equipment for higher pitch wire bonding applications; hand-operated wire bonding tools used in the assembly of semiconductors, namely die collets, capillaries and wedge bonders
7 Dicing blades, namely, power-operated blades attached within dicing equipment to cut semiconductor wafers into individual integrated circuit chips; die attachment equipment, namely, semiconductor assembly equipment for picking up and placing individual silicon chips on a substrate and printed circuit board; [ solder ball placement equipment, namely, semiconductor assembly equipment used to place solder balls onto substrate material; ] wafer bumping equipment, namely, semiconductor assembly equipment for bonding stud bumps onto a silicon wafer; [ and wafer preparation equipment, namely, semiconductor assembly equipment for placing the wafer onto a plastic membrane and metal frame ]
37 Maintenance and refurbishment of equipment used in back-end assembly of semiconductors, namely, integrated circuit ball bonders, wedge bonders, manual wire bonders, [ automated dicing equipment, ] ribbon bonders, stud bumpers, [ wafer preparation equipment, testing equipment and ball attachment equipment; ] on-line consulting and advisory services for said equipment maintenance and refurbishment
35 Providing on-line electronic commerce services, namely, on-line catalog for selection, [ ordering and payment ] of products and services, namely, automatic wire bonding equipment, tools and materials, bonder software, die attachment equipment, dicing [ equipment and ] blades, factory automation products and services, [ electrical circuit substrates, ] manual wire bonding equipment, [ solder ball placement equipment, ] wafer bumping equipment, wafer bumping services, [ wafer preparation equipment, wafer test products and package test products, ] and on-line customer support services [ relating thereto ], namely, on-line supply, on-line logistics and support, on-line consulting services for factory productivity consisting of monitoring semiconductor equipment status and collecting data and managing process programs in local and distant manufacturing plants to enhance overall yields and reduce cycle times
42 Providing on-line information regarding software developments in the field of semiconductor manufacturing; providing on-line information regarding technical packaging application support, namely, design of new bonding capillaries based on customer-specific capillary configurations; [ on-line design for others in the field of semiconductor packaging assembly, namely, semiconductor packaging product design application support for the development, testing and assembly of new electrical circuits, all in the field of back-end assembly of semiconductors; providing customized on-line web pages featuring user-defined information, which includes search engines and on-line web links to other web sites; design and fabrication services for others, namely, design and engineering of electrical printed circuit boards used in the semiconductor industry and the design and manufacturing of digital, analog and mix signal circuit boards; ] technical support services rendered in person, via telephone and via global computer network relating to the use of equipment used for the back-end assembly of semiconductors and installation of spare parts therefor
KULICKE & SOFFA
Color is not claimed as a feature of the mark.
Mar 13, 2024
Teas Section 8 & 9 Received
Dec 2, 2022
Courtesy Reminder - Sec. 8 (10-Yr)/Sec. 9 E-Mailed
Jan 29, 2018
Attorney/Dom.Rep.Revoked And/Or Appointed
Jan 29, 2018
Teas Revoke/App/Change Addr Of Atty/Dom Rep Received
Jun 17, 2014
Notice Of Acceptance Of Sec. 8 & 9 - E-Mailed
Jun 17, 2014
Registered And Renewed (First Renewal - 10 Yrs)
Jun 17, 2014
Registered - Sec. 8 (10-Yr) Accepted/Sec. 9 Granted
Jun 17, 2014
Case Assigned To Post Registration Paralegal
May 30, 2014
Teas Section 8 & 9 Received
Jan 4, 2010
Registered - Sec. 8 (6-Yr) Accepted & Sec. 15 Ack.
Dec 16, 2009
Automatic Update Of Assignment Of Ownership
Dec 11, 2009
Case Assigned To Post Registration Paralegal
Dec 9, 2009
Automatic Update Of Assignment Of Ownership
Dec 2, 2009
Teas Section 8 & 15 Received
Dec 3, 2003
Exparte Appeal Terminated
Dec 2, 2003
Registered-Principal Register
Sep 9, 2003
Published For Opposition
Aug 20, 2003
Notice Of Publication
Jun 30, 2003
Approved For Pub - Principal Register
Apr 11, 2003
Correspondence Received In Law Office
May 21, 2003
Case File In Ticrs
May 20, 2003
Case File In Ticrs
May 13, 2003
Jurisdiction Restored To Examining Attorney
Apr 29, 2003
Ex Parte Appeal-Instituted
Apr 11, 2003
Paper Received
Apr 25, 2003
Exparte Appeal Received At Ttab
Oct 10, 2002
Final Refusal Mailed
Oct 9, 2002
Assigned To Examiner
Sep 27, 2002
Assigned To Examiner
Aug 26, 2002
Correspondence Received In Law Office
Aug 26, 2002
Paper Received
Feb 25, 2002
Non-Final Action Mailed
Feb 22, 2002
Assigned To Examiner
Dec 14, 2001
Preliminary/Voluntary Amendment - Entered
Dec 14, 2001
Correspondence Received In Law Office
Trademark Alertz updated from USPTO on 2030-01-24
