Trademark: 76242261
Status Date
Wednesday, January 18, 2023
Registration Number
2597606
Registration Date
Tuesday, July 23, 2002
Filing Date
Tuesday, April 17, 2001
Published for Opposition
Tuesday, April 30, 2002
1 METALLIZED CERAMIC SUBSTRATES, NAMELY, PLATED COPPER ON THICK FILM ELECTRONIC SUBSTRATES FOR USE IN THE FURTHER MANUFACTURE OF ELECTRICAL TELECOMMUNICATION, MICROWAVE, [ DATA TRANSLATION,] POWER, BIOMEDICAL EQUIPMENT, NAMELY, RF POWER AMPLIFIERS, WIRELESS COMMUNICATORS, MICROWAVE MODULES, SWITCHES, CONVERTERS, AND CHIP CARRIERS
Jan 18, 2023
Notice Of Acceptance Of Sec. 8 & 9 - E-Mailed
Jan 18, 2023
Registered And Renewed (Second Renewal - 10 Yrs)
Jan 18, 2023
Registered - Sec. 8 (10-Yr) Accepted/Sec. 9 Granted
Jan 18, 2023
Case Assigned To Post Registration Paralegal
Jul 1, 2022
Teas Section 8 & 9 Received
Jul 31, 2012
Notice Of Acceptance Of Sec. 8 & 9 - Mailed
Jul 31, 2012
Registered And Renewed (First Renewal - 10 Yrs)
Jul 31, 2012
Registered - Sec. 8 (10-Yr) Accepted/Sec. 9 Granted
Jul 31, 2012
Case Assigned To Post Registration Paralegal
Jul 19, 2012
Teas Section 8 & 9 Received
Aug 16, 2008
Registered - Sec. 8 (6-Yr) Accepted & Sec. 15 Ack.
Jul 25, 2008
Assigned To Paralegal
Jul 14, 2008
Teas Section 8 & 15 Received
Nov 2, 2007
Case File In Ticrs
Jul 23, 2002
Registered-Principal Register
Apr 30, 2002
Published For Opposition
Apr 10, 2002
Notice Of Publication
Oct 26, 2001
Approved For Pub - Principal Register
Aug 3, 2001
Correspondence Received In Law Office
Jun 28, 2001
Non-Final Action Mailed
Jun 22, 2001
Assigned To Examiner
Trademark Alertz updated from USPTO on 2030-01-24
