Word

ACCRETECH

Status

Dead

Status Code

606

Status Date

Saturday, September 17, 2005

Serial Number

76198020

Mark Type

3000

Filing Date

Monday, January 22, 2001

Published for Opposition

Tuesday, June 24, 2003

Abandoned Date

Saturday, September 17, 2005

Trademark Owner History

Tokyo Seimitsu Co., Ltd. - Owner At Publication

Classifications

9 Precision measuring machines, namely wafer thickness measuring machine, non-contact flatness measuring machine, digital length measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, surface texture measuring machine, three-dimensional measuring machine, surface texture and contour measuring machine, contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine, coordinate measuring machine; data processing machines for use in processing coordinate measuring data, machine control gauge, displacement sensor, electric micrometer, pneumatic micrometer; computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines and instruments and their parts and fittings, namely ultrasonic depth sounders; Automatic distribution vending machines; Network system comprised of computer hardware and software for wafer probing machines; Wafer inspection units

37 Repair and maintenance service for manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; repair and maintenance of data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines

The stippling shown in the drawing is a feature of the mark.

Trademark Events

Nov 21, 2005

Abandonment Notice Mailed - No Use Statement Filed

Nov 21, 2005

Abandonment - No Use Statement Filed

Apr 9, 2005

Extension 3 Granted

Mar 16, 2005

Extension 3 Filed

Mar 16, 2005

Teas Extension Received

Sep 20, 2004

Extension 2 Granted

Sep 9, 2004

Extension 2 Filed

Sep 9, 2004

Teas Extension Received

Aug 17, 2004

Case File In Ticrs

Apr 26, 2004

Assigned To Examiner

Mar 25, 2004

Extension 1 Granted

Mar 12, 2004

Extension 1 Filed

Mar 15, 2004

Paper Received

Sep 16, 2003

Noa Mailed - Sou Required From Applicant

Jun 24, 2003

Published For Opposition

Jun 4, 2003

Notice Of Publication

Apr 12, 2003

Approved For Pub - Principal Register

Apr 1, 2003

Fax Received

Mar 13, 2003

Non-Final Action Mailed

Mar 12, 2003

Previous Allowance Count Withdrawn

Mar 3, 2003

Approved For Pub - Principal Register

Jan 13, 2003

Paper Received

Jan 8, 2003

Assigned To Examiner

Jan 8, 2003

Previous Allowance Count Withdrawn

Sep 12, 2002

Approved For Pub - Principal Register

Jul 15, 2002

Correspondence Received In Law Office

Jul 15, 2002

Paper Received

Feb 11, 2002

Final Refusal Mailed

Nov 9, 2001

Correspondence Received In Law Office

May 11, 2001

Non-Final Action Mailed

May 8, 2001

Assigned To Examiner

Apr 30, 2001

Assigned To Examiner