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Trademark: 76188063
Word
THERMAL MANAGEMENT SUBSTRATE
Status Date
Wednesday, June 5, 2002
Filing Date
Tuesday, January 2, 2001
Abandoned Date
Wednesday, April 10, 2002
9 Printed circuit board adapted for use as a heat dissipating laminate
40 Mass lamination of thermal printed circuit board laminates for others
Jun 5, 2002
Abandonment - Failure To Respond Or Late Response
Oct 9, 2001
Non-Final Action Mailed
Jun 8, 2001
Correspondence Received In Law Office
May 16, 2001
Non-Final Action Mailed
May 3, 2001
Assigned To Examiner
Apr 11, 2001
Assigned To Examiner
Trademark Alertz updated from USPTO on 2030-01-24