35 Providing a database of consumer information regarding products and services available for assembly of semiconductors; providing on-line retail electronic commerce services, namely, on-line catalog for selection, ordering and payment of products and services, namely, automatic wire bonding equipment, tools and materials, bonder software, die attachment equipment and tools, dicing equipment and blades, factory automation products and services, substrate technology services, manual wire bonding equipment, tools and materials, package singulation equipment and blades, solder ball placement equipment, wafer bumping equipment, tools and materials, wafer bumping services, wafer preparation equipment, wafer test products and package test products, all in the field of back-end assembly of semiconductors; on-line customer-specific business consulting services for supply, logistics and support, all in the field of back-end assembly of semiconductors