Trademark: 76087708
Status Date
Friday, January 6, 2023
Registration Number
2586317
Registration Date
Tuesday, June 25, 2002
Filing Date
Thursday, July 13, 2000
Published for Opposition
Tuesday, June 12, 2001
Cancellation Date
Friday, January 6, 2023
1 compositions of phenolic epoxy and other resins which may or may not contain electrostatic dissipative materials combined with glass cloth and cured under heat and pressure to form a themoset composite which is then fabricated into pallets for carrying and protecting printed circuit boards through the reflow solder process and the wave solder process
Jan 6, 2023
Cancelled Sec. 8 (10-Yr)/Expired Section 9
Jun 25, 2021
Courtesy Reminder - Sec. 8 (10-Yr)/Sec. 9 E-Mailed
Dec 2, 2011
Registered And Renewed (First Renewal - 10 Yrs)
Dec 2, 2011
Registered - Sec. 8 (10-Yr) Accepted/Sec. 9 Granted
Dec 1, 2011
Teas Section 8 & 9 Received
Jul 7, 2008
Registered - Sec. 8 (6-Yr) Accepted & Sec. 15 Ack.
Jun 30, 2008
Assigned To Paralegal
Jun 13, 2008
Teas Section 8 & 15 Received
Oct 9, 2007
Case File In Ticrs
Jun 25, 2002
Registered-Principal Register
Apr 5, 2002
Allowed Principal Register - Sou Accepted
Mar 19, 2002
Assigned To Examiner
Mar 14, 2002
Statement Of Use Processing Complete
Feb 28, 2002
Use Amendment Filed
Sep 4, 2001
Noa Mailed - Sou Required From Applicant
Jun 12, 2001
Published For Opposition
May 30, 2001
Notice Of Publication
Feb 8, 2001
Approved For Pub - Principal Register
Jan 26, 2001
Examiner's Amendment Mailed
Dec 5, 2000
Assigned To Examiner
Trademark Alertz updated from USPTO on 2030-01-24
