37 Installation and maintenance of machines for the manufacture and treatment of semiconductor substrates, silicon chips, wafers, LCD-substrates, LCD-displays, semiconductor chips and solar cells as well as their surfaces; Machines and systems for drying, cleaning and etching of silicon chips in semiconductor production as well as wet-processing machines therefor and for oxidation with ozonated water, for oxidation with dilute hydrofluoric and hydrochloric acid and for particle cleaning in ammonia and hydrogen peroxide acid bath, as well as for ozone-steam-strip-cleaning for removing organic impurities and photo sensitive resist; drying machines using nitrogen, alcohol-vapors and/or mixtures thereof; machines for drying and wet processing of semiconductor substrates, silicon chips, wafers, LCD-substrates, LCD-displays, semiconductor chips and solar cells as well as their surfaces