1 CHEMICALS FOR USE IN THE MANUFACTURE AND ASSEMBLY OF PRINTED CIRCUITS, ELECTRONIC COMPONENTS AND SEMICONDUCTOR PACKAGES; CHEMICAL COMPOUNDS, NAMELY, RESIN COATINGS USED AS TEMPORARY SOLDER MASKS TO PREVENT THE ADHERENCE OF SOLDER TO BASE METAL FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY; THERMOPLASTIC PASTE ADHESIVES FOR USE IN THE MANUFACTURE OF ELECTRONIC ASSEMBLIES; SOLDERING CHEMICALS, NAMELY, AQUEOUS MACHINE DESCALERS FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY; SOLDER CHEMICALS AND ANTIOXIDANTS FOR USE WITH SOLDER; CHEMICAL PREPARATIONS IN THE NATURE OF RUST INHIBITORS; SOLDERING FLUX; WATER SOLUBLE SOLDERING FLUX; LOW SOLIDS SOLDER FLUX; SOLDERING FLUX, ZINC CHLORIDE TYPE; SOLDER CHEMICALS AND ANTIOXIDANTS FOR USE WITH SOLDER; FLUXES USED FOR SOLDERING ELECTRONIC CIRCUITS, WHICH DO NOT REQUIRE CLEANING AFTER SAID USE; OXIDATION CHEMICALS FOR PROTECTING THE SURFACE TO WHICH THEY ARE APPLIED FOR USE IN CONNECTION WITH SOLDER; SILVER/GLASS DIE ATTACH MATERIAL ADHESIVES FOR USE IN SILICON CHIP BINDING; CHEMICAL PREPARATIONS FOR SOLDERING, NAMELY, SOLDERING INJECTION CHEMICALS TO REDUCE OXIDE FORMATION ON BRIDGE CONDUCTION LINES, SURFACE CONDITIONING CHEMICALS TO PREPARE SURFACES FOR SOLDERING; PROTECTIVE CHEMICAL COATINGS TO MAINTAIN SOLDERABILITY OF SURFACES; ULTRAVIOLET CURABLE POLYMERS FOR USE IN LEGEND INKS, SOLDER MASKS AND ETCHING/PLATING RESISTS; SOLDERING CHEMICALS, NAMELY, AQUEOUS RESIST STRIPPER FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY