Trademark: 75733700
Status Date
Thursday, April 11, 2002
Filing Date
Tuesday, June 22, 1999
Abandoned Date
Monday, February 25, 2002
9 ELECTRONIC COMPONENTS, NAMELY, SOLDER BUMPED SEMICONDUCTOR SILICON CHIPS AND WAFERS; SOLDER BUMPED ELECTRONIC SUBSTRATES FOR USE IN FURTHER MANUFACTURE OF ELECTRONICS; AND SOLDER BUMPED ELECTRICAL CIRCUIT BOARDS
Apr 11, 2002
Abandonment - Failure To Respond Or Late Response
Aug 24, 2001
Disapproval - Amendment To Use Mailed
Jun 18, 2001
Amendment To Use Processing Complete
Mar 15, 2001
Use Amendment Filed
Sep 21, 2000
Non-Final Action Mailed
May 26, 2000
Correspondence Received In Law Office
Dec 3, 1999
Non-Final Action Mailed
Nov 16, 1999
Assigned To Examiner
Trademark Alertz updated from USPTO on 2030-01-24