Trademark: 75733700
Word
COPPER CORE CSP
Status
Dead
Status Code
602
Status Date
Thursday, April 11, 2002
Serial Number
75733700
Mark Type
1000
Filing Date
Tuesday, June 22, 1999
Abandoned Date
Monday, February 25, 2002

Trademark Owner History

Classifications
9 ELECTRONIC COMPONENTS, NAMELY, SOLDER BUMPED SEMICONDUCTOR SILICON CHIPS AND WAFERS; SOLDER BUMPED ELECTRONIC SUBSTRATES FOR USE IN FURTHER MANUFACTURE OF ELECTRONICS; AND SOLDER BUMPED ELECTRICAL CIRCUIT BOARDS

Trademark Events
Apr 11, 2002
Abandonment - Failure To Respond Or Late Response
Aug 24, 2001
Disapproval - Amendment To Use Mailed
Jun 18, 2001
Amendment To Use Processing Complete
Mar 15, 2001
Use Amendment Filed
Sep 21, 2000
Non-Final Action Mailed
May 26, 2000
Correspondence Received In Law Office
Dec 3, 1999
Non-Final Action Mailed
Nov 16, 1999
Assigned To Examiner

Trademark Alertz updated from USPTO on 2030-01-24