Trademark: 75719597
Word
SOLDER COLUMN INTERPOSER
Status Date
Monday, February 4, 2002
Filing Date
Wednesday, June 2, 1999
Abandoned Date
Monday, February 4, 2002
9 Substrates for semi-conductors; glazed substrates for thermal printer heads; polyimide thin film multilayer substrates for semi-conductors; integrated circuit packages for semi-conductors; chip packages; crystal resonator SAW(Surface Acoustic Wave) filter package; leadless chip carriers; interposers for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid arrays chip packages; ball grid array chip packages; aluminum nitride products and cerdips, namely, ceramic packages or substrates used in the manufacture of integrated circuits; printed circuits; printed wiring; multilayer printed circuit board
Feb 4, 2002
Abandonment - After Ex Parte Appeal
Aug 21, 2002
Exparte Appeal Terminated
Feb 4, 2002
Exparte Appeal Dsmsed - Failure To File Brief
Jul 2, 2001
Continuation Of Final Refusal Mailed
Jun 6, 2001
Jurisdiction Restored To Examining Attorney
Jun 6, 2001
Ex Parte Appeal-Instituted
Jan 11, 2001
Final Refusal Mailed
May 18, 2000
Correspondence Received In Law Office
Nov 23, 1999
Non-Final Action Mailed
Nov 12, 1999
Assigned To Examiner
Nov 5, 1999
Assigned To Examiner
Trademark Alertz updated from USPTO on 2030-01-24
