Trademark: 75515057
Status Date
Saturday, July 8, 2006
Registration Number
2281260
Registration Date
Tuesday, September 28, 1999
Filing Date
Wednesday, July 8, 1998
Published for Opposition
Tuesday, July 6, 1999
Cancellation Date
Saturday, July 8, 2006
9 Protective covers and lids have been pre-applied with fast bonding or curing adhesive preforms, for use in place of encapsulant and molding compound used for protection of semiconductor, electronic modules
Jul 8, 2006
Cancelled Sec. 8 (6-Yr)
Jul 1, 2006
Cancelled Sec. 8 (6-Yr)
Sep 28, 1999
Registered-Principal Register
Jul 6, 1999
Published For Opposition
Jun 4, 1999
Notice Of Publication
Apr 14, 1999
Approved For Pub - Principal Register
Apr 14, 1999
Assigned To Examiner
Mar 26, 1999
Examiner's Amendment Mailed
Mar 10, 1999
Assigned To Examiner
Trademark Alertz updated from USPTO on 2030-01-24