Trademark: 75512915
Status Date
Friday, August 26, 2011
Registration Number
2423783
Registration Date
Tuesday, January 23, 2001
Filing Date
Thursday, July 2, 1998
Published for Opposition
Tuesday, January 11, 2000
Cancellation Date
Friday, August 26, 2011
1 Adhesives for use in the semiconductor chip industry
7 Machines for manufacturing semiconductor chip packages
9 Microelectronic products, namely, semiconductor chip packages, and semiconductor devices
The stippling is a feature of the mark and does not indicate color.
Aug 26, 2011
Cancelled Sec. 8 (10-Yr)/Expired Section 9
Apr 26, 2007
Registered - Sec. 8 (6-Yr) Accepted & Sec. 15 Ack.
Mar 19, 2007
Response Received To Post Reg. Action - Sec. 8 & 15
Mar 19, 2007
Paper Received
Mar 5, 2007
Post Registration Action Mailed - Sec. 8 & 15
Mar 1, 2007
Assigned To Paralegal
Jan 8, 2007
Registered - Sec. 8 (6-Yr) & Sec. 15 Filed
Jan 8, 2007
Teas Section 8 & 15 Received
Jul 18, 2006
Case File In Ticrs
Jan 23, 2001
Registered-Principal Register
Nov 8, 2000
Allowed Principal Register - Sou Accepted
Aug 14, 2000
Statement Of Use Processing Complete
Aug 14, 2000
Use Amendment Filed
Apr 4, 2000
Noa Mailed - Sou Required From Applicant
Jan 11, 2000
Published For Opposition
Dec 10, 1999
Notice Of Publication
Oct 29, 1999
Approved For Pub - Principal Register
Aug 23, 1999
Correspondence Received In Law Office
May 18, 1999
Final Refusal Mailed
Apr 5, 1999
Correspondence Received In Law Office
Feb 11, 1999
Non-Final Action Mailed
Feb 2, 1999
Assigned To Examiner
Trademark Alertz updated from USPTO on 2030-01-24
