Trademark: 75434293
Word
ABC ALUMINUM BONDED COPPER
Status Date
Saturday, December 2, 2000
Filing Date
Friday, February 13, 1998
Published for Opposition
Tuesday, March 9, 1999
Abandoned Date
Saturday, December 2, 2000
9 printed circuits boards including ultra-thin aluminum separator plates with micro electroplated plated copper foil, ultrasonically bonded to one or both sides, used as combination material component and process consumable during the lay-up, fabrication, and lamination of printed circuit boards
May 12, 2001
Abandonment - No Use Statement Filed
Aug 7, 2000
Extension 2 Granted
Jun 1, 2000
Extension 2 Filed
Jan 21, 2000
Extension 1 Granted
Nov 29, 1999
Extension 1 Filed
Jun 1, 1999
Noa Mailed - Sou Required From Applicant
Mar 9, 1999
Published For Opposition
Feb 5, 1999
Notice Of Publication
Nov 5, 1998
Approved For Pub - Principal Register
Nov 4, 1998
Assigned To Examiner
Oct 2, 1998
Examiner's Amendment Mailed
Sep 25, 1998
Assigned To Examiner
Trademark Alertz updated from USPTO on 2030-01-24