Trademark: 75370818
Word
DI PAK THE FUTURE OF CERAMIC PACKAGING
Status Date
Wednesday, August 23, 2000
Filing Date
Thursday, October 9, 1997
Published for Opposition
Tuesday, November 30, 1999
Abandoned Date
Wednesday, August 23, 2000
9 Ceramic packaging for integrated circuits and electronic devices, namely, transistors, transducers and combinations thereof
"PAK" and "CERAMIC PACKAGING"
The mark consists of the stylized wording "DI PAK", the phrase "THE FUTURE OF CERAMIC PACKAGING", and the design of a sphere with a stylized letter "D" on the surface.
The lining and the stippling in the drawing indicate shading.
DYE PACK
Nov 17, 2000
Abandonment - No Use Statement Filed
Feb 22, 2000
Noa Mailed - Sou Required From Applicant
Nov 30, 1999
Published For Opposition
Oct 29, 1999
Notice Of Publication
Aug 4, 1999
Approved For Pub - Principal Register
Jul 14, 1999
Examiner's Amendment Mailed
Mar 5, 1999
Non-Final Action Mailed
Jan 25, 1999
Non-Final Action Mailed
Nov 27, 1998
Correspondence Received In Law Office
Jun 19, 1998
Non-Final Action Mailed
Jun 17, 1998
Assigned To Examiner
Jun 4, 1998
Assigned To Examiner
Trademark Alertz updated from USPTO on 2030-01-24