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Trademark: 75317317
Status Date
Saturday, May 12, 2001
Filing Date
Monday, June 30, 1997
Published for Opposition
Tuesday, February 16, 1999
Abandoned Date
Saturday, May 12, 2001
1 thermoplastic and thermoset resins used for electronic computer chip packages; encapsulants and sealants made of silica and epoxy used as a protective coating for electronic components
Jul 10, 2001
Abandonment - No Use Statement Filed
Jan 16, 2001
Extension 3 Granted
Nov 8, 2000
Extension 3 Filed
Jul 7, 2000
Extension 2 Granted
May 10, 2000
Extension 2 Filed
Dec 23, 1999
Extension 1 Granted
Nov 10, 1999
Extension 1 Filed
May 11, 1999
Noa Mailed - Sou Required From Applicant
Feb 16, 1999
Published For Opposition
Jan 15, 1999
Notice Of Publication
Oct 14, 1998
Approved For Pub - Principal Register
Aug 17, 1998
Correspondence Received In Law Office
Feb 23, 1998
Non-Final Action Mailed
Feb 19, 1998
Assigned To Examiner
Feb 12, 1998
Assigned To Examiner
Jan 30, 1998
Assigned To Examiner
Trademark Alertz updated from USPTO on 2030-01-24