Trademark: 74703149
Status Date
Wednesday, June 4, 1997
Filing Date
Wednesday, July 19, 1995
Abandoned Date
Wednesday, April 2, 1997
7 dicing saw for programmable slicing or cutting of microelectronic wafers for the purpose of separating the wafer into individual chips
Jun 4, 1997
Abandonment - Failure To Respond Or Late Response
Oct 2, 1996
Non-Final Action Mailed
Aug 12, 1996
Correspondence Received In Law Office
Feb 12, 1996
Non-Final Action Mailed
Jan 28, 1996
Assigned To Examiner
Jan 26, 1996
Assigned To Examiner
Trademark Alertz updated from USPTO on 2030-01-24