The service mark consists of a circle (with a flat spot on the botton) which represents an integrated circuit wafer, a grid superimposed upon said circle that indiciates individual integrated circuit die, a box superimposed upon said grid that represents a magnified view of a single die, a row of solid squares along the inside perimeter of said box that represents bonding pads, and the letters "MRL" diagonally contained within the perimeter of said squares.
The perimeter line of the circle, the lines of the grid, the perimeter line of the box, the solid squares, and the letters are all one color, preferably black; the interior of the grid is a color that is not the same as the perimeter line of the circle; the interior of said box may differ from the color of the interior of the grid and is a color that is not the same as the perimeter line of the circle.