Trademark: 74174142
Status Date
Wednesday, April 21, 1993
Filing Date
Monday, June 10, 1991
Published for Opposition
Tuesday, July 28, 1992
Abandoned Date
Wednesday, April 21, 1993
17 low durometer molded thermally conductive elastomers for manufacturing use; namely, a pad which is interposed between a printed circuit board and a heat sink or other thermally conductive layer so as to remove heat from the electronic components
Apr 21, 1993
Abandonment - No Use Statement Filed
Oct 20, 1992
Noa Mailed - Sou Required From Applicant
Jul 28, 1992
Published For Opposition
Jun 26, 1992
Notice Of Publication
Apr 9, 1992
Approved For Pub - Principal Register
Apr 2, 1992
Examiner's Amendment Mailed
Mar 23, 1992
Non-Final Action Mailed
Dec 13, 1991
Correspondence Received In Law Office
Oct 31, 1991
Non-Final Action Mailed
Sep 14, 1991
Assigned To Examiner
Trademark Alertz updated from USPTO on 2030-01-24