Trademark: 74049649
Word
ASSEMBLY TECHNOLOGIES
Status
Dead
Status Code
602
Status Date
Monday, May 4, 1992
Serial Number
74049649
Mark Type
1000
Filing Date
Friday, March 16, 1990
Abandoned Date
Friday, March 13, 1992

Trademark Owner History

Classifications
7 automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, namely the bonding of microelectronic circuit chips to lead frames and the electro-optical inspection of the finished product, programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices
9 automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, namely the bonding of microelectronic circuit chips to lead frames and the electro-optical inspection of the finished product, programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices
37 maintenance and repair services for automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, namely the bonding of microelectronic circuit chips to lead frams and the electro-optical inspection of the finished product and programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices

Trademark Events
May 4, 1992
Abandonment - Failure To Respond Or Late Response
Sep 12, 1991
Final Refusal Mailed
Aug 19, 1991
Assigned To Examiner
Mar 27, 1991
Correspondence Received In Law Office
Sep 27, 1990
Non-Final Action Mailed
Aug 13, 1990
Assigned To Examiner

Trademark Alertz updated from USPTO on 2030-01-24