1 Chemicals-Namely, Epoxy Resins for Formulating Products for Use in Protecting the Elements of Electrical and Electronic Apparatus; Silicone Resins for Formulating Products to Protect or Enhance Properties in Fields Including Aerospace, Military, Electrical, Electronic, and Industrial; Urethane Resins for Formulating Products Used to Protect Various Sensitive Devices; Polyester Resins Used to Formulate Products to Provide Protection in Applications Including Electronic and Electrical; Adhesive Compounds to Formulate Products to Bond Similar and Dissimilar Substrates Including Metals, Ceramics, Plastics and Glass; Solvents Used to Prepare Surfaces, Disintegrate Organic Resin Systems and as Integral Components in Coatings and Other Systems to Enhance Properties or Improve Application; Low Friction Casting Compounds; Hollow Spheres Made of Glass or Synthetic Resins or Similar Materials for Use in a Variety of Resin Systems Including Aerospace; Plastic Foam for Use in Protecting Electronic Packaging and Heat and Vibration Insulation, and Electrical and Electronic Property Variations; Inorganic Materials Including Sand, Clay, Talc, Asbestos, Quartz, Calcium Carbonate, Graphite and Carbon Black Used as Fillers in Plastic Material Including Silicones, Epoxies and Urethanes; Liquid Resins Including Epoxies, Urethanes and Silicones which Are Pourable into Molds or Other Containers and which Solidify into Various Shaped Objects; Chemical Compositions-Namely, Powders and Fluids Exhibiting Various Dielectric Properties