Trademark: 73162765
Word
HI-TEK
Status
Dead
Status Code
710
Status Date
Friday, November 25, 1988
Serial Number
73162765
Registration Number
1193497
Registration Date
Tuesday, April 13, 1982
Mark Type
1000
Filing Date
Monday, March 20, 1978
Published for Opposition
Tuesday, December 25, 1979
Cancellation Date
Friday, November 25, 1988

Trademark Owner History
Lamination Technology, Inc. - Original Registrant

Classifications
6 Copper Clad Laminates Comprising an Insulative Substrate, Epoxy Resin and Outer Layers of Copper Foil

Trademark Events
Nov 25, 1988
Cancelled Sec. 8 (6-Yr)
Apr 13, 1982
Registered-Principal Register

Trademark Alertz updated from USPTO on 2030-01-24