Trademark: 79390988
Word
UBINECT
Status Date
Friday, May 24, 2024
Filing Date
Thursday, November 9, 2023
9 Copper clad laminates for electrical communication machines and apparatus; copper clad laminates for printed circuit boards; copper clad laminates for computers; electronic circuit boards; electronic circuits; electronic control circuits; electronic integrated circuits; electrical circuits; computer circuit boards; circuit boards.
6 Copper foils; copper alloy foils; cables of metal, non-electric; copper pipes; copper alloy sheets; tubes of copper alloys; non-electric multi-strand wires; wires of common metal; non-electric cables and wires of common metals; metal cable wires.
Mar 7, 2024
Sn Assigned For Sect 66a Appl From Ib
Mar 20, 2024
New Application Office Supplied Data Entered
Apr 24, 2024
Application Filing Receipt Mailed
May 14, 2024
Non-Final Action Written
May 15, 2024
Non-Final Action (Ib Refusal) Prepared For Review
May 24, 2024
Non-Final Action Mailed - Refusal Sent To Ib
May 24, 2024
Refusal Processed By Mpu
May 7, 2024
Assigned To Examiner
Trademark Alertz updated from USPTO on 2030-01-24